全站搜索 - 9 - 晶振,石英晶振,贴片晶振,温补晶振,KDS晶振,爱普生晶振,京瓷晶振,进口晶振

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: CITIZEN晶振,CM309B晶振,无源晶体谐振器

低频晶振可从3.5MHz起对应,小型,超薄型具备强防焊裂性,石英晶体在极端严酷的环境条件下也能发挥稳定的起振特性,产品本身具有耐热,耐振,耐撞击等优良的耐环境特性,满足无铅焊接以及高温回流温度曲线要求,符合AEC-Q200标准.
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: CITIZEN晶振,无源晶振,CM309E晶振

贴片石英晶体谐振器,又简称为排带包装,这是这产品采用排带盘式包装,使产品在焊接时能采用SMT自动贴片机高速的焊接,大大节约人工,提高工作效率.此款SMD晶体并且可以承受回流焊接的高温,波峰焊接,回流焊接等。
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: CITIZEN晶振,石英晶体谐振器,CM309S晶振

音叉型石英晶体谐振器,晶振产品本身具备优良的耐热性,耐环境特性,在办公自动化,家电领域,移动通信领域可发挥优良的电气特性,符合无铅标准,满足无铅焊接的回流温度曲线要求,
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: CITIZEN晶振,石英贴片晶振,CM519晶振

32.768KHz千赫子时钟晶体,其本身主要应用在时钟控制产品,或者是控制模块,主要给时钟芯片提供一个基准信号,其主要各项功能还得看应用何种产品. 本产品具有小型,薄型,轻型的贴片晶振表面型音叉式石英晶体谐振器,产品具有优良的耐热性,耐环境特性
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: 精工晶振,VT-308晶振,智能通讯晶振

型　　号：VT-308晶振

封　　装：DIP插件封装

负载电容：6PF,9PF,12.5pf

工作温度：-40~+85度

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: 精工晶振,VT-200-FL晶振,32.768K插件晶振

型　　号：VT-200FL晶振

封　　装：DIP插件封装

负载电容：7PF,6PF,9PF,12.5pf

工作温度：-40~+85度

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: 精工晶振,VT-150-F晶振,1.5*5晶振

型　　号：VT-150-F晶振

封　　装：DIP插件封装

负载电容：7PF,9PF,12.5pf

工作温度：-10~+60度

储存温度：-30~+70度

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: 精工晶振,VT-200-F晶振,日本原装进口音叉晶体

型　　号：VT-200-F晶振

封　　装：DIP插件封装

负载电容：7PF,9PF,12.5pf

工作温度：-10~+60度

储存温度：-30~+70度
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: 精工晶振,SSP-T7-FL晶振,耐高温晶振

型　　号：SSP-T7-F晶振

封　　装：SMD贴片晶振

负载电容：7PF,9PF,12.5pf

工作温度：-40~+85度

储存温度：-55~+125度
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: 精工晶振,SC-32T晶振,3215石英晶体

型　　号：SC-32T晶振

封　　装：SMD贴片晶振

负载电容：7PF,9PF,12.5pf

工作温度：-40~+85度

储存温度：-55~+125度
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: 精工晶振,SC-32A晶振,3215晶振

型　　号：SC-32A晶振

封　　装：SMD贴片晶振

负载电容：7PF,9PF,12.5pf

工作温度：-40~+85度

储存温度：-55~+125度
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: 精工晶振,SC-32S晶振,精工32.768K

型　　号：SC-32S晶振

封　　装：SMD贴片晶振

负载电容：7PF,9PF,12.5pf

工作温度：-40~+85度

储存温度：-55~+125度
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: CITIZEN晶振,石英晶体谐振器,CM309A晶振

音叉型石英晶体谐振器,晶振产品本身具备优良的耐热性,耐环境特性,在办公自动化,家电领域,移动通信领域可发挥优良的电气特性,符合无铅标准,满足无铅焊接的回流温度曲线要求,金属外壳的石英晶振使得产品在封装时能发挥比陶瓷晶振外壳更好的耐冲击性能.
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: 爱普生晶振,SMD晶体,FC-255晶振,FC-255 32.7680K-A3

32.768K时钟晶体具有小型,"FC-255 32.7680K-A3"薄型,轻型的贴片晶振表面音叉型晶体谐振器,产品具有优良的耐热性,耐环境特性,可发挥晶振优良的电气特性,符合RoHS规定,满足无铅焊接的高温回流温度曲线要求,金属外壳的封装使得产品在封装时能发挥比陶瓷谐振器外壳更好的耐冲击性.
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: KDS晶振,石英晶振,DT-26晶振

引脚焊接型石英晶体元件..高精度的频率和晶振本身更低的等效串联电阻.常用负载电容,49/S石英晶振,因插件型镜头成本更低和更高的批量生产能力.

主要应用于电视,机顶盒,LCDM和游戏机家用常规电器数码产品等的最佳选择.符合RoHS/无铅.
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: 西铁城晶体,进口晶振,CM315晶振

尺寸:3.2*1.5*0.9mm 频率:32.768KHz 32.768K时钟晶体具有小型,薄型,轻型的贴片晶振表面音叉型晶体谐振器,产品具有优良的耐热性,耐环境特性,可发挥晶振优良的电气特性,符合RoHS规定,满足无铅焊接的高温回流温度曲线要求,金属外壳的封装使得产品在封装时能发挥比陶瓷谐振器外壳更好的耐冲击性.
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: KDS晶振,石英晶振,DST520晶振

贴片晶振本身体积小,超薄型石英晶体谐振器,特别适用于有目前高速发展的高端电子数码产品,因为晶振本身小型化需求的市场领域,小型?薄型是对应陶瓷谐振器(偏差大)和普通的石英晶体谐振器(偏差小)的中间领域的一种性价比较出色的产品.
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[技术支持]TAITIEN晶振OCXO技术赋能设备长效稳定运行2026年07月20日 13:39

TAITIEN晶振OCXO技术赋能设备长效稳定运行
在5G通信基站,5G卫星通信设备晶振,精密测量仪器,工业自动化控制系统,智能安防监测,高端车载设备等核心领域,设备长期不间断,高精度,零故障稳定运行是保障系统正常运作,数据精准传输,时序同步统一的核心基础.而恒温晶体振荡器(OCXO)作为高端电子设备的"频率基准核心",承担着整机高精度频率输出,时序校准,信号稳频,数据同步的关键职能,其频率稳定性,温度漂移控制,功耗管控,长期运行可靠性,直接决定高端精密设备的整机性能,运行精度与服役寿命.
传统常规OCXO恒温晶振普遍存在行业共性短板:恒温腔体功耗偏高,待机能耗大,长期运行发热严重,温漂补偿精度不足,高低温环境频率偏移明显,难以适配当下设备低能耗,长效值守,超稳频,免维护,严苛工况适配的高阶需求.高功耗不仅会造成设备能耗浪费,整机发热升温,供电负荷过载,还会缩短设备续航时长,增加运维成本,而频率稳定性不足则会引发信号失真,时序错乱,数据偏差,设备同步失效等各类故障,成为高端精密设备性能升级的核心瓶颈.

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阅读（785）标签：TAITIEN泰艺晶振|OCXO振荡器|台产进口晶振

[新闻动态]SEIKO精工SH-32R系列高精度晶体振荡器重塑行业标准2026年07月13日 14:56

SEIKO精工SH-32R系列高精度晶体振荡器重塑行业标准
SEIKO精工SH-32R系列高精度晶体振荡器是精工针对中高端精密电子设备时序需求,专项迭代优化的高精度,高可靠,高一致性时钟频率器件.产品依托精工百年精密石英加工技术,纳米级晶片抛光工艺,精细化逐颗精度调校体系,摒弃普通晶振粗放式生产模式,从原材料筛选,晶片切割塑形,频率校准,封装防护,出厂检测全流程升级,聚焦超高初始精度,超低温漂特性,极致参数一致性,长效抗老化,强环境适配五大核心维度,实现全方位性能突破.该系列晶振标准频点覆盖行业通用32.768KHz,完美适配绝大多数电子设备的系统时钟,计时校准,定时唤醒,数据同步需求,同时凭借碾压级的精度与稳定性优势,全面适配普通晶振无法胜任的精密场景,兼顾通用性与专业性,是目前中高端电子设备时钟迭代升级的优选核心器件.

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阅读（74）标签：SEIKO精工晶振|车载智能设备晶振|32.768KHz通用晶振

[新闻动态]QTCC578系列低相位噪声LVDS时钟差分晶振芯片2026年07月03日 16:44: QTCC578系列低相位噪声LVDS时钟差分晶振芯片
Q-Tech晶振QTCC578系列采用行业优选的超微型精密贴片封装,整机尺寸仅为5.00×7.00×1.50mm,超薄低轮廓机身设计,极大压缩PCB板面占用空间,完美适配高速通信模块,微型精密测控设备,便携式军工电子,高密度工控主板等紧凑版型设备的布局需求.相较于传统LVDS差分时钟器件体积臃肿,占位过大,难以适配微型设备的短板,QTCC578系列在极致精简尺寸的同时,不压缩任何核心性能,实现了微型化封装+高性能输出+高可靠结构的完美平衡,大幅降低终端产品结构设计难度,助力高速电子设备实现轻量化,集成化,微型化品质升级.

9PHToZZwRx9RvjcSTghnbb","text":{"initialAttributedTexts":{"text":{"0":"Q-Tech QTCC578系列采用行业优选的超微型精密贴片封装，整机尺寸仅为5.00×7.00×1.50mm，超薄低轮廓机身设计，极大压缩PCB板面占用空间，完美适配高速通信模块、微型精密测控设备、便携式军工电子、高密度工控主板等紧凑版型设备的布局需求。相较于传统LVDS差分时钟器件体积臃肿、占位过大、难以适配微型设备的短板，QTCC578系列在极致精简尺寸的同时，不压缩任何核心性能，实现了微型化封装+高性能输出+高可靠结构的完美平衡，大幅降低终端产品结构设计难度，助力高速电子设备实现轻量化、集成化、微型化品质升级。"},"attribs":{"0":"*0*1+5i*0*1*2+h*0*1+1b"}},"apool":{"numToAttrib":{"0":["ai-extra","{\"is_ai_gen\":true,\"rewrite_command\":1}"],"1":["author","7592593332774128587"],"2":["bold","true"]},"nextNum":3}},"type":"text","referenceRecordMap":{},"extra":{"channel":"saas","isEqualBlockSelection":false,"pasteRandomId":"53293a9b-2d83-491c-ac8b-24a443e494ad","mention_page_title":{},"external_mention_url":{}},"isKeepQuoteContainer":false,"isFromCode":false,"selection":[{"id":4,"type":"text","selection":{"start":64,"end":326},"recordId":"WneLf15WndTLGncbG1QcntmFnNc"}],"payloadMap":{},"isCut":false}'>; 阅读（84）标签：Q-Tech有源晶振|LVDS差分晶振

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